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CFAs: Innovation and Technology Support Programme (Hong Kong)

CFP: Acceleration Program and Innovation Challenge in Georgia

Deadline: 17-Jul-2026

The Innovation and Technology Support Programme (ITSP) supports applied R&D projects in Hong Kong that promote innovation and technology transfer to local industries.

The programme is designed to:

It is structured into three project types: platform, seed, and collaborative projects.

Key Project Types

Platform Projects (Industry-Oriented Applied R&D)

These projects focus on commercialisation-ready research.

Key features:

Seed Projects (Exploratory R&D)

These are early-stage or experimental research projects.

Key features:

Collaborative Projects (Industry–Research Partnerships)

These projects support joint development between research institutions and industry.

Key features:

Funding Structure Summary

Who is Eligible?

For Platform and Seed Projects

Eligible applicants include:

For Collaborative Projects

Eligible structure:

Intellectual Property (IP) Rules

Project Duration

Programme Objectives

The ITSP aims to:

Why This Programme Matters

The ITSP strengthens innovation by connecting research institutions with industry needs.

It helps:

Conclusion

The Innovation and Technology Support Programme (ITSP) in Hong Kong provides structured funding for applied R&D through platform, seed, and collaborative projects. By supporting both early-stage research and industry-driven innovation, the programme enhances technology transfer and strengthens collaboration between research institutions and industry partners.

For more information, visit Innovation and Technology Commission.

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