Deadline: 24-Sep-2026
The CHIPS Joint Undertaking (CHIPS JU) EU-Japan Market-Oriented Call supports collaborative semiconductor innovation projects between Europe and Japan focused on next-generation chip technologies, artificial intelligence, chiplets, advanced integration, and industrial deployment. Innovation Fund Denmark provides national co-funding support for eligible Danish participants involved in successful projects, with funding available up to €650,000 per Danish partner and up to €1.3 million per Danish-coordinated project.
Program Overview
The CHIPS JU EU-Japan Market-Oriented Call supports international research and innovation collaboration between European and Japanese organisations working on advanced semiconductor technologies.
The initiative aims to accelerate semiconductor development for artificial intelligence applications and strengthen industrial deployment of emerging chip technologies.
The call encourages cooperation between research institutions, companies, universities, and technology organisations to develop innovative semiconductor solutions that contribute to future digital industries.
Program at a Glance
- Program Name: CHIPS JU EU-Japan Market-Oriented Call
- Focus Area: Semiconductor innovation and advanced chip technologies
- Geographic Scope: Europe and Japan collaboration
- Funding Support: National co-funding for Danish participants
- Supporting Organization: Innovation Fund Denmark
- Eligible Danish Applicants: Universities, companies, industry organisations, RTOs, and research organisations
Program Objectives
The call aims to:
- Strengthen semiconductor cooperation between Europe and Japan.
- Develop next-generation semiconductor technologies.
- Advance AI-focused chip innovation.
- Support industrial deployment of semiconductor solutions.
- Promote advanced chip manufacturing approaches.
- Encourage collaboration between research and industry partners.
Key Technology Areas
Projects should focus on advanced semiconductor technologies, including:
Artificial Intelligence (AI) Semiconductor Technologies
Research and innovation may include:
- AI-optimized chips.
- Advanced computing architectures.
- Semiconductor solutions for artificial intelligence applications.
- High-performance computing technologies.
Chiplet Technologies
Projects may explore:
- Modular semiconductor architectures.
- Chiplet-based system design.
- Improved chip performance and flexibility.
- Advanced integration approaches.
2.5D and 3D Semiconductor Integration
Supported activities may include:
- Advanced packaging technologies.
- Three-dimensional chip integration.
- Improved semiconductor efficiency.
- High-density computing solutions.
Integrated Photonics
Projects may focus on:
- Optical semiconductor technologies.
- Photonic integrated circuits.
- High-speed communication solutions.
- Energy-efficient computing systems.
Industrial Deployment
The call encourages projects that move semiconductor innovations toward practical applications by supporting:
- Technology validation.
- Industry adoption.
- Commercial deployment pathways.
- Collaboration between research and industrial partners.
Why This Call Matters
Semiconductors are essential for modern technologies including artificial intelligence, advanced computing, telecommunications, and digital infrastructure.
The EU-Japan collaboration helps:
- Strengthen semiconductor supply chains.
- Accelerate technological innovation.
- Improve industrial competitiveness.
- Develop advanced AI hardware solutions.
- Connect European and Japanese semiconductor ecosystems.
Who Is Eligible?
The call is open to Danish organisations involved in successful CHIPS JU EU-Japan projects.
Eligible applicants include:
- Universities.
- Companies.
- Industry organisations.
- Research and Technology Organisations (RTOs).
- Research organisations.
All Danish organisations directly participating in project activities may apply for national co-funding from Innovation Fund Denmark.
Funding Information
Innovation Fund Denmark provides co-funding for Danish participants.
Funding Limits
For projects with more than one Danish partner:
- Maximum national funding: €650,000 per project
- Maximum national funding: €650,000 per Danish partner
For projects coordinated by a Danish organisation:
- Maximum national funding: €1.3 million per project
- Maximum national funding: €650,000 per Danish partner
Minimum funding amount:
- €50,000 per partner
Additional information:
- EU co-funding is not included in the national funding limits.
- Funding applies only to eligible Danish participants.
How the Funding Works
The process involves:
- Organisations participate in a CHIPS JU EU-Japan collaborative project.
- Successful Danish participants apply for national co-funding.
- Innovation Fund Denmark evaluates eligible applications.
- Approved Danish partners receive financial support for project activities.
How to Apply
Applicants should follow these steps:
- Confirm eligibility as a Danish organisation.
- Participate in an eligible CHIPS JU EU-Japan project proposal.
- Define the semiconductor innovation activities to be carried out.
- Prepare project and financial information.
- Submit an application to Innovation Fund Denmark.
- Provide required documentation demonstrating project participation and budget needs.
Expected Project Outcomes
Supported projects are expected to contribute to:
- Advanced semiconductor technologies.
- AI hardware innovation.
- Improved chip design and integration.
- Stronger Europe-Japan technology partnerships.
- Increased industrial adoption of semiconductor solutions.
- Enhanced competitiveness of semiconductor industries.
Common Mistakes to Avoid
Applicants should avoid:
- Applying without participation in a CHIPS JU EU-Japan project.
- Failing to explain the industrial impact of the technology.
- Providing unclear project roles.
- Submitting incomplete financial information.
- Ignoring eligibility requirements for Danish participants.
Tips for a Strong Application
Applicants can strengthen proposals by:
- Clearly defining semiconductor innovation goals.
- Demonstrating collaboration between research and industry.
- Explaining AI and advanced chip applications.
- Showing potential for industrial deployment.
- Providing realistic budgets and implementation plans.
Frequently Asked Questions (FAQs)
What is the CHIPS JU EU-Japan Market-Oriented Call?
It is a collaborative funding opportunity supporting semiconductor innovation projects between European and Japanese organisations.
What technologies are supported under the call?
The call supports next-generation semiconductor technologies, including AI chips, chiplets, 2.5D/3D integration, integrated photonics, and industrial deployment solutions.
Who provides funding for Danish participants?
Innovation Fund Denmark provides national co-funding for eligible Danish organisations participating in successful projects.
How much funding can Danish organisations receive?
Danish participants may receive up to €650,000 per partner, while Danish-coordinated projects may receive up to €1.3 million per project.
Who can apply for Danish co-funding?
Eligible applicants include universities, companies, industry organisations, research organisations, and Research and Technology Organisations (RTOs).
Is EU funding included in the Danish funding limits?
No. EU co-funding is separate and is not included in the national funding limits.
What is the minimum funding amount available?
The minimum national funding amount is €50,000 per partner.
Conclusion
The CHIPS JU EU-Japan Market-Oriented Call provides a strategic opportunity to strengthen semiconductor innovation through Europe-Japan collaboration. By supporting advanced technologies such as AI chips, chiplets, 3D integration, and integrated photonics, the program helps accelerate industrial deployment and strengthen the future semiconductor ecosystem. Innovation Fund Denmark’s co-funding enables Danish organisations to participate effectively in these international innovation projects.
For more information, visit Innovation Fund Denmark.