Call for Applications: Power Electronics Innovation Projects

The Chips Joint Undertaking (Chips JU) IA Resilience Call 2026 provides €20 million in funding to strengthen Europe’s power electronics ecosystem and enhance industrial resilience across the semiconductor value chain. Eligible organisations can apply for grants ranging from €1 million to €10 million for projects focused on Wide Band Gap (WBG) technologies, advanced semiconductor devices, packaging, AI integration, and next-generation power electronics.

What is the Chips JU IA Resilience Call?

The IA Resilience Call is a funding opportunity launched by the Chips Joint Undertaking (Chips JU) under the European Chips Act to accelerate innovation in power electronics and reinforce Europe’s semiconductor manufacturing capabilities.

The programme supports collaborative research, innovation, and industrial development projects that strengthen Europe’s strategic autonomy in semiconductor technologies while improving resilience across the entire semiconductor value chain.

Projects are expected to contribute to secure, reliable, energy-efficient, and cost-competitive electronic systems that address future industrial and technological needs.

Programme Objectives

The call aims to:

Strengthen Europe’s semiconductor ecosystem.
Improve industrial resilience in power electronics.
Accelerate innovation in semiconductor technologies.
Advance Wide Band Gap (WBG) materials and devices.
Improve performance, reliability, and robustness of power electronic systems.
Promote trustworthy, secure, and resilient electronics.
Support Europe’s long-term technological competitiveness.

Key Highlights

Programme Name: Chips JU IA Resilience Call 2026
Organiser: Chips Joint Undertaking (Chips JU)
Total Budget: €20 million
Grant Amount: €1 million to €10 million per project
Application Opening Date: 7 July 2026
Application Deadline: 16 September 2026
Project Focus: Power electronics and semiconductor innovation
Eligible Regions: EU Member States, EEA countries, Associated Countries, OECD countries, and Mercosur countries (subject to call eligibility rules)

Funding Priorities

The IA Resilience Call supports projects across the power electronics value chain, including:

Wide Band Gap (WBG) Technologies

Projects involving:

Wide Band Gap substrates
Gallium Nitride (GaN) platforms
Silicon Carbide (SiC) platforms
Cost-effective WBG manufacturing solutions

Semiconductor Manufacturing Innovation

Eligible activities include:

Wafer cutting technologies
Smart stacking
Thin-layer transfer
Advanced epitaxy
Ultra Wide Band Gap (UWBG) materials
Semiconductor process innovation

Next-Generation Power Semiconductor Devices

Projects focused on:

Optimised power semiconductor devices
High-performance electronic components
Intelligent semiconductor devices
Integrated sensing and control capabilities

Advanced Packaging and Integration

The programme supports:

Advanced semiconductor packaging
Heterogeneous integration
Functional integration
System-level integration technologies

Advanced Characterisation

Projects may include:

Characterisation of advanced materials
Device testing
System performance analysis
Reliability assessment

Artificial Intelligence Integration

The call encourages the implementation of:

Artificial Intelligence (AI) at the system level
AI-enabled semiconductor innovation
Intelligent optimisation of electronic systems

Project Requirements

Funded projects should:

Deliver innovative power electronics technologies.
Improve semiconductor performance and efficiency.
Increase reliability and robustness.
Enhance cost competitiveness.
Strengthen supply chain resilience.
Reduce equipment failures and operational disruptions.
Minimise data corruption.
Contribute to trustworthy and secure electronics.

Projects are encouraged to align with Europe’s long-term semiconductor strategy.

Collaboration and Strategic Synergies

Applicants are encouraged to:

Collaborate with the Wide Band Gap (WBG) Pilot Line.
Create synergies with other semiconductor pilot lines.
Engage with Competence Centres established under the Chips for Europe Initiative.
Build upon existing European semiconductor initiatives.

These collaborations are expected to maximise project impact and strengthen Europe’s semiconductor ecosystem.

Who is Eligible?

Applications are open to eligible legal entities established in:

European Union (EU) Member States
European Economic Area (EEA) countries
Associated Countries
Organisation for Economic Co-operation and Development (OECD) countries
Mercosur countries

All applicants must satisfy the eligibility requirements specified in the official call documentation.

Funding Amount

The programme provides:

Minimum Grant: €1 million
Maximum Grant: €10 million
Total Available Budget: €20 million

Funding supports collaborative innovation projects that contribute to Europe’s semiconductor resilience.

How to Apply

Follow these steps to submit an application:

Review the official IA Resilience Call eligibility requirements.
Confirm that your organisation is located in an eligible country.
Develop a project aligned with the call’s priorities.
Build partnerships where appropriate.
Prepare a detailed technical proposal and project budget.
Demonstrate the expected technological and industrial impact.
Submit the application before 16 September 2026.

Why This Call Matters

Semiconductors are critical to modern industries, including automotive, renewable energy, telecommunications, healthcare, aerospace, and industrial automation.

The IA Resilience Call helps Europe:

Strengthen semiconductor manufacturing.
Improve technological independence.
Accelerate innovation.
Increase supply chain resilience.
Support clean energy technologies.
Enhance digital transformation.
Build secure and reliable electronic systems.

The programme plays an important role in implementing the objectives of the European Chips Act.

Tips for a Strong Proposal

To improve your chances of success:

Clearly demonstrate technological innovation.
Align your project with Europe’s semiconductor priorities.
Include measurable technical outcomes.
Highlight collaboration with pilot lines or Competence Centres.
Explain the project’s contribution to industrial resilience.
Present a realistic implementation plan and budget.
Demonstrate long-term commercial or industrial impact.

Common Mistakes to Avoid

Avoid these common issues:

Submitting projects outside the programme’s technical scope.
Failing to demonstrate innovation.
Providing unclear project objectives.
Ignoring collaboration opportunities with existing European initiatives.
Submitting incomplete technical or financial documentation.
Missing the application deadline.

Frequently Asked Questions (FAQs)

1. What is the total budget for the IA Resilience Call?

The programme has a total budget of €20 million.

2. How much funding can a project receive?

Projects can receive grants ranging from €1 million to €10 million.

3. Who can apply?

Eligible legal entities established in EU Member States, EEA countries, Associated Countries, OECD countries, and Mercosur countries, subject to the official eligibility rules.

4. What types of projects are eligible?

Projects focused on Wide Band Gap technologies, semiconductor devices, advanced packaging, AI integration, semiconductor manufacturing innovation, and trustworthy electronics.

5. When did the call open?

The application period opened on 7 July 2026.

6. What is the application deadline?

Applications must be submitted by 16 September 2026.

7. What are the main objectives of the programme?

The programme aims to strengthen Europe’s power electronics ecosystem, improve semiconductor innovation, enhance industrial resilience, and develop secure, reliable, and high-performance electronic systems.

Conclusion

The Chips JU IA Resilience Call 2026 offers €20 million in funding to accelerate innovation across Europe’s semiconductor and power electronics sectors. With grants of up to €10 million, the programme supports collaborative projects that advance Wide Band Gap technologies, intelligent semiconductor devices, advanced packaging, AI-enabled systems, and resilient electronics, helping Europe strengthen its technological leadership and industrial competitiveness under the Chips for Europe Initiative.