Grants for International Semiconductor Collaboration Initiative

The European Commission is inviting grant applications for collaborative EU–Japan semiconductor research and innovation projects that advance next-generation semiconductor technologies and manufacturing. The programme provides €3 million to €5 million per project, with a total budget of €5 million, supporting multinational consortia that bring together industry, academia, and research organizations.

What is the European Commission EU–Japan Semiconductor Collaboration Programme?

The EU–Japan Semiconductor Collaboration Programme supports international research and innovation projects that strengthen cooperation between the European Union and Japan in the semiconductor sector.

The programme promotes the development of advanced semiconductor technologies, manufacturing processes, and industrial applications through multidisciplinary collaboration involving researchers, universities, semiconductor companies, technology developers, and innovation partners.

It also contributes to Europe’s strategic objectives of strengthening semiconductor resilience, accelerating technological innovation, and enhancing international cooperation.

Background

Semiconductors are critical components powering artificial intelligence, telecommunications, automotive systems, consumer electronics, healthcare technologies, and industrial automation.

As global demand for advanced chips continues to grow, the European Union and Japan are strengthening collaboration to develop next-generation semiconductor manufacturing technologies, improve supply chain resilience, and accelerate commercial innovation.

This programme supports joint research efforts that bridge scientific discovery with industrial deployment while contributing to international semiconductor standards.

Programme Objectives

The programme aims to:

Strengthen EU–Japan cooperation in semiconductor technologies.
Advance next-generation semiconductor manufacturing.
Support multidisciplinary research and innovation.
Accelerate industrial adoption of new technologies.
Promote collaboration between industry and academia.
Improve semiconductor performance and manufacturing efficiency.
Contribute to global semiconductor standards.

Key Highlights

Programme Name: EU–Japan Semiconductor Collaboration Grants 2026
Funding Organisation: European Commission
Total Programme Budget: €5,000,000
Grant Amount: €3,000,000–€5,000,000
Project Type: Collaborative research and innovation projects
Collaboration: European Union and Japan partnerships

Focus Areas

Projects should contribute to one or more of the following priority areas.

Advanced 2.5D and 3D Integration

Projects may develop:

Advanced chip integration methods.
Multi-die packaging technologies.
High-performance heterogeneous integration.
Next-generation semiconductor architectures.

Integrated Photonics

The programme supports innovations in:

Integrated photonics manufacturing.
Photonic chip processes.
Optical semiconductor technologies.
High-speed communication components.

Chiplet Technologies

Projects may focus on:

Chiplet co-optimization.
Modular semiconductor architectures.
Advanced chiplet integration.
System-level optimization.

Interface Design

Supported activities include:

Advanced interface engineering.
High-speed interconnects.
Signal integrity improvements.
Semiconductor communication interfaces.

Through-Silicon Vias (TSVs)

Projects may develop:

Through-silicon via technologies.
Vertical integration techniques.
Improved chip connectivity.
High-density packaging solutions.

Interposers and Bonding Technologies

The programme supports:

Advanced interposer development.
Wafer bonding techniques.
Hybrid bonding.
Semiconductor packaging innovations.

Multidisciplinary Collaboration

Projects should encourage collaboration among experts in:

Material science.
Chemical engineering.
Semiconductor manufacturing.
Artificial intelligence.
Electronics engineering.
Industrial research.

Industry and Research Partnerships

The programme promotes cooperation between:

Universities.
Research institutes.
Semiconductor manufacturers.
Technology companies.
Industrial partners.
Innovation organisations.

Commercialisation and Industrial Applications

Projects should help:

Translate research into industrial products.
Increase technology readiness.
Improve manufacturing capabilities.
Support market adoption of semiconductor innovations.

Global Semiconductor Standards

The programme encourages contributions toward:

International technology standards.
Interoperability.
Manufacturing best practices.
Global semiconductor collaboration.

Expected Outcomes

Successful projects are expected to:

Develop innovative semiconductor manufacturing technologies.
Strengthen EU–Japan scientific collaboration.
Improve advanced chip integration techniques.
Accelerate commercial deployment of semiconductor innovations.
Build stronger partnerships between academia and industry.
Contribute to internationally recognized semiconductor standards.
Support Europe’s long-term semiconductor competitiveness.

Who Can Apply?

Applicants must apply as a consortium.

Eligible applicants include:

Universities.
Higher education institutions.
Research organisations.
Semiconductor manufacturers.
Technology companies.
Innovation centres.
Public and private research institutions.
Other eligible legal entities.

Consortium Requirements

Applications must include:

At least three independent legal entities.
Organisations established in EU Member States or EEA countries.
Compliance with programme participation and security requirements.

Projects are encouraged to establish strong collaboration with Japanese research and industrial partners.

Funding Information

Total Programme Budget: €5,000,000
Grant Size: €3,000,000–€5,000,000

Funding supports collaborative research, technology development, innovation activities, and industrial cooperation.

How to Apply

Interested applicants should:

Review the official European Commission call documentation.
Confirm eligibility and consortium requirements.
Form a multidisciplinary consortium with eligible partners.
Develop a collaborative semiconductor innovation project.
Prepare a technical work plan, implementation strategy, and budget.
Demonstrate scientific excellence, industrial relevance, and EU–Japan collaboration.
Submit the proposal through the European Commission’s official funding portal before the application deadline.

Why This Programme Matters

Semiconductors are fundamental to digital transformation, artificial intelligence, advanced manufacturing, telecommunications, healthcare, and clean technologies.

This programme helps to:

Strengthen international semiconductor cooperation.
Advance next-generation chip technologies.
Enhance Europe’s technological competitiveness.
Support industrial innovation.
Improve semiconductor manufacturing capabilities.
Foster knowledge exchange between Europe and Japan.
Accelerate commercialization of advanced semiconductor research.

By connecting industry, academia, and research organisations, the programme supports long-term innovation across the global semiconductor ecosystem.

Tips for a Strong Proposal

To strengthen your application:

Build a balanced consortium with complementary expertise.
Demonstrate clear EU–Japan collaboration.
Include strong industrial participation.
Present innovative semiconductor technologies with commercial potential.
Define measurable technical milestones and deliverables.
Address technology readiness and market impact.
Show how the project contributes to international semiconductor standards.

Common Mistakes to Avoid

Avoid these common issues:

Forming a consortium that does not meet eligibility requirements.
Presenting weak collaboration between academic and industrial partners.
Failing to demonstrate innovation beyond existing technologies.
Providing unclear commercialization pathways.
Submitting unrealistic work plans or budgets.
Ignoring programme security and participation requirements.

Frequently Asked Questions (FAQs)

1. What is the EU–Japan Semiconductor Collaboration Programme?

It is a European Commission funding programme that supports collaborative projects between the European Union and Japan to develop advanced semiconductor technologies and strengthen international research partnerships.

2. How much funding is available?

The programme has a total budget of €5,000,000, with individual grants ranging from €3,000,000 to €5,000,000.

3. What research areas are supported?

The programme supports projects involving 2.5D/3D integration, integrated photonics, chiplets, through-silicon vias, interposers, bonding technologies, semiconductor manufacturing, AI-enabled semiconductor innovation, industrial applications, and global standards development.

4. Who can apply?

Eligible applicants are consortia of at least three independent legal entities established in EU Member States or EEA countries, subject to the programme’s participation and security requirements.

5. Is collaboration with Japanese partners encouraged?

Yes. The programme is specifically designed to strengthen research and innovation collaboration between the European Union and Japan in advanced semiconductor technologies.

6. What types of organisations can participate?

Universities, research organisations, semiconductor manufacturers, technology companies, innovation centres, and other eligible legal entities may participate as consortium members.

7. Why is this programme important?

The programme strengthens international cooperation, accelerates semiconductor innovation, supports industrial competitiveness, advances next-generation chip technologies, and contributes to the development of global semiconductor standards.

Conclusion

The European Commission EU–Japan Semiconductor Collaboration Grants 2026 provide a significant opportunity for research institutions, universities, and industry partners to advance cutting-edge semiconductor technologies through international collaboration. With grants of €3 million to €5 million, the programme promotes multidisciplinary research, strengthens EU–Japan partnerships, and supports innovations that enhance semiconductor manufacturing, industrial applications, and global technological leadership.