Call for Chip Design Skills Development Programme

The European Commission is inviting applications for a Chip Design Skills Programme that will strengthen semiconductor education and chip design skills across the European Union. With a total budget of €15 million, the programme provides grants ranging from €1 million to €15 million to eligible international consortia for projects lasting four years.

What is the European Commission Chip Design Skills Programme?

The Chip Design Skills Programme is a European Commission initiative designed to expand semiconductor education, develop chip design expertise, and encourage more students to pursue careers in the European semiconductor industry.

The programme supports collaborative projects that make chip design and fabrication accessible learning experiences for students while strengthening Europe’s semiconductor skills ecosystem through partnerships between education, industry, research institutions, and Competence Centres.

Background

The semiconductor industry plays a vital role in technologies such as:

• Artificial Intelligence (AI)
• High-performance computing
• Consumer electronics
• Automotive systems
• Telecommunications
• Healthcare technologies
• Industrial automation

To address growing demand for semiconductor professionals, the European Commission is investing in education, practical training, and industry collaboration to build a highly skilled workforce capable of supporting Europe’s technological competitiveness.

Programme Objectives

The programme aims to:

• Strengthen semiconductor education across Europe.
• Improve chip design skills among students.
• Increase student participation in semiconductor careers.
• Promote practical chip fabrication experience.
• Build stronger collaboration between education and industry.
• Expand Europe’s semiconductor talent pipeline.
• Support long-term innovation in chip design.

Key Highlights

• Programme Name: Chip Design Skills Programme
• Organiser: European Commission
• Total Funding Available: €15,000,000
• Grant Amount: €1,000,000 to €15,000,000
• Project Duration: 4 years
• Geographic Coverage: European Union
• Primary Focus: Semiconductor education and chip design skills

Focus Areas

Projects should address one or more of the following areas.

Chip Design Skills Development

Activities may include:

• Semiconductor design education.
• Integrated circuit (IC) design.
• Electronic Design Automation (EDA) training.
• Practical chip design experience.

Semiconductor Education

Projects should strengthen:

• University programmes.
• Secondary school initiatives.
• STEM education.
• Semiconductor curricula.
• Technical training.

Student Engagement

The programme encourages:

• Student participation in chip design.
• Hands-on fabrication experiences.
• Innovation competitions.
• Practical learning opportunities.

Tape-Out Support

A major component of the programme is supporting student chip fabrication.

Applicants must allocate:

• At least 60% of the total project budget to students’ tape-outs.

This allows students to move from chip design to physical semiconductor fabrication.

Collaboration Across the Semiconductor Ecosystem

Projects should promote collaboration among:

• Schools.
• Universities.
• Competence Centres.
• Semiconductor companies.
• Industry partners.
• Research organisations.
• Other relevant stakeholders.

Skills Ecosystem Development

Projects should complement existing European initiatives, including:

• EUROPRACTICE
• European Design Platform
• Competence Centres
• Other semiconductor education programmes

Expected Activities

Successful projects may include:

• Chip design training programmes.
• Semiconductor education courses.
• Practical fabrication projects.
• Student tape-outs.
• Workshops and bootcamps.
• Industry mentoring.
• Cross-border collaboration.
• Skills development events.
• Awareness campaigns promoting semiconductor careers.

Accessibility Requirements

Programme activities must be:

• Widely accessible across all 27 EU Member States.
• Inclusive for students from diverse educational backgrounds.
• Designed to encourage broad participation in semiconductor education.

Who Can Apply?

Eligible applicants include legal entities established in:

• EU Member States.
• European Economic Area (EEA) countries.

Potential participants include:

• Universities.
• Higher education institutions.
• Research organisations.
• Competence Centres.
• Industry partners.
• Technology organisations.
• Educational institutions.
• Other eligible legal entities.

Consortium Requirements

Applicants must form an eligible consortium that:

• Includes beneficiaries from at least three different EU Member States or EEA countries.
• Meets all programme participation requirements.
• Complies with applicable European security conditions.

Funding Information

• Total Programme Budget: €15,000,000
• Grant Amount: €1,000,000 to €15,000,000
• Project Duration: 4 years

A minimum of 60% of the project budget must be dedicated to supporting student tape-outs.

How to Apply

Interested organisations should:

1. Review the official European Commission call documentation.
2. Confirm organisational eligibility.
3. Build an eligible multinational consortium.
4. Design a programme aligned with semiconductor education objectives.
5. Allocate at least 60% of the budget to student tape-outs.
6. Develop a detailed implementation plan, budget, and work programme.
7. Submit the proposal through the official European Commission funding portal before the application deadline.

Why This Programme Matters

Europe’s semiconductor industry requires a highly skilled workforce to support future innovation.

This programme helps to:

• Build semiconductor expertise.
• Prepare future chip designers.
• Increase practical learning opportunities.
• Strengthen industry-academia collaboration.
• Expand Europe’s technology workforce.
• Support innovation in semiconductor manufacturing.
• Enhance Europe’s technological competitiveness.

The initiative also contributes to the objectives of the European Chips Act by strengthening long-term skills development.

Tips for a Strong Proposal

To improve your application:

• Develop strong partnerships between academia and industry.
• Include practical chip design and fabrication activities.
• Ensure broad participation across EU Member States.
• Present a clear strategy for student engagement.
• Demonstrate alignment with existing European semiconductor initiatives.
• Include measurable education and skills outcomes.
• Develop a sustainability plan beyond the project period.

Common Mistakes to Avoid

Avoid these common issues:

• Allocating less than 60% of the budget to student tape-outs.
• Providing limited practical learning opportunities.
• Failing to demonstrate collaboration across the semiconductor ecosystem.
• Submitting proposals without sufficient geographic coverage.
• Presenting weak student engagement strategies.
• Overlooking security and participation requirements.

Frequently Asked Questions (FAQs)

1. What is the objective of the Chip Design Skills Programme?

The programme aims to strengthen semiconductor education and chip design skills while encouraging students across Europe to pursue careers in the semiconductor industry.

2. How much funding is available?

The programme has a total budget of €15 million, with grants ranging from €1 million to €15 million.

3. Who can apply?

Eligible applicants are legal entities established in EU Member States or EEA countries that form a consortium with beneficiaries from at least three different eligible countries.

4. What activities are supported?

The programme supports semiconductor education, chip design training, student tape-outs, industry collaboration, practical learning, awareness activities, and skills development initiatives.

5. Is there a minimum budget allocation requirement?

Yes. At least 60% of the total project budget must be allocated to supporting students’ tape-outs.

6. How long can projects run?

Projects funded under this programme will have a duration of four years.

7. Why is this programme important?

The programme strengthens Europe’s semiconductor talent pipeline by expanding access to chip design education, increasing hands-on fabrication experience, fostering collaboration between education and industry, and supporting the long-term competitiveness of the European semiconductor ecosystem.

Conclusion

The European Commission Chip Design Skills Programme 2026 provides a major opportunity for educational institutions, industry partners, research organisations, and Competence Centres to strengthen semiconductor education across Europe. With €15 million in funding, long-term project support, and a strong emphasis on practical chip design and fabrication, the programme will help develop the next generation of semiconductor professionals and reinforce Europe’s leadership in advanced microelectronics and digital innovation.