Deadline: 07-May-2026
The Chips for Europe Initiative is inviting applications to strengthen technological capacity and innovation in advanced packaging technologies by accelerating the transfer of solutions from pilot lines to industrial deployment. Danish participants in successful projects may receive national co-funding of up to EUR 650,000 per partner, or up to EUR 1.3 million per project if a Danish organisation acts as coordinator, in addition to possible separate EU co-funding under Chips JU rules.
About the Initiative
The Chips for Europe Initiative supports projects that build technological capacity in electronic components and systems (ECS) and help move advanced packaging technologies from pilot development into real industrial use.
The initiative is designed to strengthen Europe’s innovation ecosystem by supporting projects that improve industrial readiness, scale up technological solutions, and enhance the resilience of critical supply chains.
Objectives of the Call
The programme focuses on boosting Europe’s capabilities in advanced packaging and related ECS technologies.
Its main objectives include:
- Strengthening technological capacity in electronic components and systems
- Reinforcing European strategic autonomy
- Accelerating the transfer of advanced packaging technologies from pilot lines to industrial deployment
- Expanding the European packaging ecosystem
- Increasing competitiveness across industries
- Supporting resilient supply chains in multiple economic sectors
Funding Information
Danish participants in successful projects may receive national co-funding, subject to national agreements.
National co-funding details:
- Maximum national co-funding: EUR 650,000 per project
- Maximum national co-funding: EUR 650,000 per Danish partner
- Minimum funding threshold: EUR 50,000 per partner
If a Danish organisation acts as project coordinator:
- The maximum national co-funding per project increases to EUR 1,300,000
- The EUR 650,000 cap per Danish partner still applies
EU Co-funding
Applicants may also be eligible for separate EU co-funding based on Chips JU criteria and applicable funding rates.
Important points to note:
- EU co-funding is separate from Danish national co-funding
- EU contributions are not included in the national co-funding cap
- The two funding streams are managed independently
This means applicants should plan for both national and EU-level financial structures when preparing their proposals.
Funding Rates
The funding intensity depends on the type of activities and the applicable programme rules.
Funding rates:
- Can range from 0% to 55% of total project costs
- Vary according to the nature of the activities and relevant guidelines
Applicants should carefully review the cost structure and ensure that the proposed budget aligns with the correct funding category.
Eligible Costs
The programme can support a broad range of project-related expenses.
Eligible costs may include:
- Salaries
- Travel
- Subcontracting
- Materials
- Communication and knowledge sharing
- Other project-related expenses
- Overhead costs
All costs should be clearly justified and directly linked to project implementation.
Who Can Apply?
The call is targeted at Danish participants directly involved in project implementation.
Eligible applicants include:
- Danish companies
- Research organisations
- Research and technology organisations (RTOs)
To qualify, applicants must be directly involved in project activities and participate in a successful project under the relevant Chips JU framework.
Why This Opportunity Matters
This is an important opportunity for Danish organisations working in microelectronics, semiconductors, packaging technologies, and industrial innovation.
The initiative supports the critical step between pilot validation and industrial deployment, which is often where many advanced technologies face challenges in scaling.
Key benefits include:
- Support for industrial uptake of advanced packaging technologies
- Stronger positioning in the European semiconductor and ECS ecosystem
- Access to both national and potential EU co-funding
- Greater collaboration across industry and research
- Contribution to European technological sovereignty
- Improved supply chain resilience and competitiveness
How to Apply
Applicants should prepare a technically strong and industry-relevant proposal aligned with advanced packaging deployment goals.
Suggested application steps:
- Confirm eligibility
Ensure your organisation is a Danish company, research organisation, or RTO directly involved in project activities. - Develop or join a strong consortium
Build partnerships that can demonstrate both technical excellence and industrial relevance. - Align the project with advanced packaging priorities
Show how your project helps move technologies from pilot lines to industrial deployment. - Plan the dual funding structure
Distinguish clearly between national co-funding and any potential EU co-funding. - Prepare a realistic budget
Keep within the EUR 50,000 minimum and EUR 650,000 per partner cap. - Assess coordinator advantage
If a Danish organisation can lead the project, explore whether the project can qualify for up to EUR 1.3 million in national co-funding. - Submit a complete proposal
Ensure both technical and financial sections are compliant with the programme rules.
Tips for Applicants
To improve your chances:
- Focus on clear industrial deployment pathways
- Show how the project strengthens the European packaging ecosystem
- Demonstrate the value for strategic autonomy and supply chain resilience
- Clearly separate national and EU funding calculations
- Build a strong case for commercial or industrial relevance
- Use realistic budgets linked to eligible costs
Common Mistakes to Avoid
Avoid these common issues:
- Confusing national co-funding with EU co-funding
- Ignoring the EUR 650,000 per partner cap
- Submitting weak industrial deployment plans
- Focusing only on research without a strong scale-up pathway
- Failing to explain the project’s role in the advanced packaging value chain
- Using cost categories without clear justification
Frequently Asked Questions (FAQs)
1. What is the maximum national co-funding available?
The maximum national co-funding is EUR 650,000 per project and EUR 650,000 per Danish partner. If a Danish organisation is the project coordinator, the project cap increases to EUR 1,300,000.
2. What is the minimum funding threshold?
The minimum national co-funding is EUR 50,000 per partner.
3. Is EU co-funding included in the national cap?
No. EU co-funding is separate and is not included in the Danish national co-funding limits.
4. What percentage of project costs can be covered?
Funding rates vary from 0% to 55% of total project costs, depending on the nature of the activities and applicable rules.
5. Who can apply?
Eligible applicants include Danish companies, research organisations, and research and technology organisations (RTOs) directly involved in project activities.
6. What kinds of costs are eligible?
Eligible costs include salaries, travel, subcontracting, materials, communication and knowledge sharing, other related expenses, and overhead costs.
7. What is the main focus of the initiative?
The main focus is to accelerate the transfer of advanced packaging technologies from pilot stages to industrial deployment, while strengthening Europe’s technological capacity and competitiveness.
Final Takeaway
The Chips for Europe Initiative offers a strong opportunity for Danish companies, research organisations, and RTOs to participate in high-impact projects that accelerate advanced packaging technologies from pilot lines into industrial deployment.
With national co-funding of up to EUR 650,000 per Danish partner, up to EUR 1.3 million per project for Danish coordinators, and the possibility of separate EU co-funding, this call is especially relevant for organisations aiming to strengthen their role in the European electronics and semiconductor ecosystem.
For more information, visit Innovation Fund Denmark.
